TISES Advisory Board

Chair: Dr. Hamid Azimi

  • Intel
  • Corporate VP, Director of Substrate Packaging TD
  • Biography

Dr. Azimi leads the Substrate Package Technology Development organization at Intel and is responsible for developing industry leading substrate package materials, processes, and equipment technologies, as well as the associated supply chain capabilities to enable high volume manufacturing for substrates across our 15+ supplier factories. He joined Intel in 1995 and has since served in various leadership roles in the Technology Development organization. Starting 2010, he led the establishment of Intel’s first substrate R&D factory in Chandler AZ which became the birthplace of panel level die embedding (EMIB) and the key corner stone for establishing package platforms for Intel data center products. Hamid holds more than a dozen patents and has given numerous talks at international conferences. He is a board member and the General Chair of International Semiconductor Executive Summit. In 2014, Hamid received the Distinguished Alumni Award from Lehigh University where he completed his PhD in Materials Science and Engineering.

Intel logo
  • Company Profile


Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, in Silicon Valley. It is the world’s largest and highest-valued semiconductor chip manufacturer on the basis of revenue, and is the developer of the x86 series of microprocessors, the processors found in most personal computers. Intel ranked No. 46 in the 2018 Fortune 500 list of the largest United States corporations by total revenue. Intel is incorporated in Delaware.