Advisory Board
Kam Lee
Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier this year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.
TSMC
More Advisory Board Members
CJ Hsieh
COO
Aspeed Technology
Aspeed Technology
Andy Chuang
VP Business Development
GaN Systems
GaN Systems
Ray Yang
Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)
ITRI
ITRI
Ian Hsu
Director IC Packaging Technology Development
Mediatek
Mediatek
Dr. Akshay Singh
VP, Advanced Packaging Technology Development
Micron
Micron
Jian Zhang
VP Product Test Engineering
Qualcomm
Qualcomm
Eric Lee
President of Sales Group
Scientech
Scientech
Samuel Liu
VP
Skymizer
Skymizer
Yu-Po Wang
VP Corporate R&D Center
SPIL
SPIL
Dr. Yu-Hua Chen
VP Carrier SBU/RD Division
Unimicron
Unimicron
Yens Ho
R&D Director
Vanguard
Vanguard
Dr. Marvin Liao / 廖德堆博士
Mario Morales
Joseph Chou
Vincent DiCaprio
Geoffrey Stoddart
Sunil Banwari
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.