Agenda – ISES Taiwan 2022 Day 1

ISES Taiwan 2022

11-12 October 2022

Theme: The Objectives and Challenges of Semiconductor Supply Chain and Strengthening Global Collaborations

ISES Taiwan logo

Day 1 – October 11

  • 08:00 – 08:40
  • Registration
  • 08:45 – 09:05
  • ISES Taiwan Welcome Address
Salah Nasri photo
Salah Nasri

President & Managing Director
ISES

Keynote Session

  • 09:10 – 09:30
  • Advancement in the 3DFabric Technology and Manufacturing
  • 09:35 – 10:05
  • Hyper-Edge Computing and AI/ML Analytics for Chiplet Yield and Quality
  • 10:10 – 10:30
  • Advanced Packaging Ecosystem: Challenges and Innovations
  • 10:35 – 11:35
  • Business Meeting Slot 1&2, Networking and Coffee Break
  • 11:40 – 12:00
  • Advanced Package Technology for Heterogeneous Integration

IC Packaging Session

  • 12:05 – 12:25
  • Advanced Packaging for Memory: Breaking New Frontiers
  • 12:30 – 12:50
  • Challenges in Wearable Devices
  • 12:55 – 13:55
  • Buffet Lunch

OSAT and Subtract Manufacturing Session

  • 14:00 – 14:20
  • Comprehensive Heterogeneous Integration Package Solution
  • 14:25 – 14:45
  • Advanced Packaging Technologies Enable New Applications
  • 14:50 – 15:10
  • Advanced Packaging Solutions and Applications with FO Technology
  • 15:15 – 15:35
  • Advanced Substrate Trend for Multichip Heterogeneous Integration
  • 15:40 – 16:10
  • Business Meeting Slot 3, Networking and Coffee Break

Equipment & Material Suppliers

  • 16:15 – 16:45
  • Panel Discussion Sponsored by Applied Materials: More-than-Moore Packaging Technology Outlook and Current Supply Chain Constraints

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  • 16:50 – 17:10
  • Advances in Interconnect and Assembly Technologies for Next Generation Electronic Systems
  • 17:15 – 17:35
  • Roadmap on Wet Processing for Advanced PLP Technology
  • 17:40 – 17:50
  • How Laser is Enabling the Semiconductor Advanced Packaging Roadmap
  • 17:55 – 18:00
  • Enabling Specialty Technologies and Advanced Packaging Solutions to Improve the Functionality and Performance of Electronic Systems
  • 18:05 – 18:10
  • Advanced Ti+Cu Seed Sputter Technologies for Glass Substrates with Through Glass Via and Through Glass Cavities as well as Low-K Polymer Laminated Glass Substrates
  • 18:15 – 21:00
  • Gala Dinner Sponsored by Onto Innovation
    Topic: Addressing Process Control Challenges in Chiplet Integration