Agenda – ISES Taiwan 2023

ISES Taiwan 2023

9-10 May 2023, Le Meridien Taipei

Theme: Shaping the Future of the Semiconductor Industry: Technical Needs and Opportunities to Drive Long-term Growth and Innovation in Semiconductor Manufacturing Industry

ISES Taiwan logo

Day 1 – May 9

  • 08:00 – 08:50
  • Registration
  • 09:00 – 09:20
  • ISES Welcome Address
Salah Nasri photo
Salah Nasri

President & Managing Director
ISES

HPC Session

  • 09:20 – 09:50
  • Innovation to Enable More Compute From Each Transistor
  • 09:50 – 10:20
  • Now is the Time to Re-imagine Memory Centric Computing
  • 10:20 – 11:20
  • Coffee Break Sponsored by CNW
    Business Meeting Slot 1 & 2, Networking and Coffee Break

Advanced Packaging Session

  • 11:20 – 11:50
  • Unleash Product Innovations with 3DFabric
  • 11:50 – 12:20
  • Heterogeneous Integration Platform for Next Generation Computing
  • 12:20 – 12:40
  • New Energy to Semiconductor - Heterogeneous Integration Packaging
  • 12:40 – 13:40
  • Buffet Lunch
  • 13:45 – 14:05
  • A 360 View of Semiconductor Test from AI and Security Perspective
  • 14:05 – 14:15
  • Hybrid Bonding: Innovation to Adoption

Automotive and Power Semiconductor Panel Session

  • 14:15 – 14:35
  • GaN is Accelerating e-Mobility
  • 14:40 – 15:20
  • Panel Discussion:
    Opportunities and Challenges for Power Semiconductor Industry. How can Taiwan Supply Chain Help?

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  • 15:20 – 16:20
  • Coffee Break Sponsored by CNW
    Business Meeting 3 & 4 Networking and Coffee Break

Equipment and Service Supplier Session

  • 16:20 – 16:30
  • Digitalisation of Supply Chain - Using Latest Technology to Improve Logistics
  • 16:30 – 16:45
  • Process Control Challenges in Packaging for High Performance Computing Applications
  • 16:45 – 16:55
  • Challenges and Solution of FLI Technologies in various HI Packaging Architetures
  • 16:55 – 17:05
  • Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow
  • 17:05 – 17:10
  • 3DIC W2W and D2W Hybrid Bonding
  • 17:10 – 17:15
  • Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications
  • 17:15 – 17:20
  • Thinfilm Technology for Heat Dissipation Layers in HPC Applications
  • 17:20 – 18:20
  • Cocktail Reception
  • 18:20 – 18:30
  • Dinner Check-in
  • 18:30 – 21:00
  • Gala Dinner Sponsored by Onto Innovation
  • Welcome Speech by Onto Innovation