Agenda – TISES 2021

6-7 December 2021 | Taipei, Taiwan

6th December 2021

Theme: Advanced Packaging and Testing
The new industry battleground – smaller, more powerful and more energy efficient chips through advanced packaging and testing

08:15 – 08:45

Registration

08:50 – 09:05

Welcome Speech

Moderator
Andy Chuang, Senior Consultant
Marvin Liao photo
09:10 – 09:40

Keynote Speaker: TSMC

  • Dr. Marvin Liao
    VP Advanced Packaging and Technology Service
  • Technology and Manufacturing Solution for 3D Chiplets
    Advanced Packaging
Dr. Hamid Azimi photo
09:45 – 10:05

Keynote Speaker: Intel

  • Dr. Hamid Azimi
    Corporate VP, Director of Substrate Packaging TD
  • Advanced Packaging Architectures: Opportunities and
    Challenges
Sonny Banwari photo
10:10 – 10:25

Keynote Speaker: Advantest

  • Sonny Banwari
    VP Business Development, Advantest Cloud Solutions (ACS)
  • Hyper Edge Computing and Machine Learning for Testing of Advanced Semiconductor Products and Technologies
10:30 – 11:30

Tea & Coffee Break
Networking & Business Meetings 1 & 2

Dr. Chih-I Wu photo
11:35 – 11:55

ITRI

  • Dr. Chih-I Wu
    VP and General Director, Electronic and Optoelectronic System Research Laborations
  • Advanced Semiconductor Technology for AIoT: ESL Design,
    Integration and Metrology
Ehsanul Islam photo
12:00 – 12:20

Qualcomm

  • Ehsanul Islam
    VP Engineering & Head of Sales and Marketing Qualcomm SEA
  • Millimeter Wave is The Missing Piece of The 5G Puzzle
12:25 – 13:25

Networking Lunch
Business Meetings 3

Moderator
Unimicron – Yu-Hua Chen, VP Carrier SBU/RD Division
KeunSoo Kim photo
13:30 – 13:50

Amkor Technology Taiwan Ltd.

  • KeunSoo Kim
    Senior Director, Advanced Product Development
  • Advanced Packaging Technologies Enable New Applications
Ian Hsu photo
13:55 – 14:15

Mediatek

  • Ian Hsu
    Director IC Packaging Technology Development
  • More Than Moore: Advanced SiP (System-in-Package) Technologies
Dr. Yu-Po Wang photo

14:20 – 14:40

SPIL

  • Dr. Yu-Po Wang
    Senior Director, Corporate R&D Center
  • Advanced Package Solution with Memory Integration for HPC Application
Jian Zhang
14:45 – 15:05

Qualcomm

  • Jian Zhang
    VP Product Test Engineering
  • Enabling Rapid Time-to-Quality/Cost in Product Testing
15:10 – 16:10

Tea & Coffee Break
Networking & Business Meetings 4 & 5

Moderator
Vanguard – Yens Ho, Director R&D
Gorgeous Technology – Joseph Chou, Director Business Development

Equipment Suppliers

Chris Scanlan photo
16:15 – 16:35

Besi

  • Chris Scanlan
    SVP Technology
  • Advanced Interconnect Technologies for the Chiplet Era
Dr. Christian Ohde photo
16:40 – 16:55

Atotech

  • Dr. Christian Ohde
    Global Product Director for Semiconductor, Lead Frame and Connectors
  • Technology Pushes Limits – Next Generation ECD Cu and E’less Deposition
Dr. Choon-Leong Lou photo
17:00 – 17:20

STAr Technologies

  • Dr. Choon-Leong Lou
    CEO & CTO
  • Advanced MEMS Probe Cards for Demanding Wafer Tests
Nelson Fan photo
17:25 – 17:35

ASM Pacific Technology Ltd (ASMPT)

  • Nelson Fan
    VP APT Business Development, Semiconductor Solution
  • ASM Pacific Technology Ltd (ASMPT) – The Total Interconnect Company
Chee Ping Lee photo
17:40 – 17:50

Lam Research

  • Chee-Ping Lee
    Technical Director
  • Heterogeneous Integration: The Next Frontier
Ralph Zoberbier
17:55 – 18:00

Evatec

  • Ralph Zoberbier
    Head of BU Advanced Packaging
  • Steps Forward in Thin Film Deposition Supporting Next
    Generation Heterogeneous Integration
18:05 – 20:10

Gala Dinner

Damon Tsai photo

Gala Dinner Presentation: Onto Innovation

  • Damon Tsai
    Product Director, Inspection BU
  • High Speed 2D/3D Inspection Solution for Advanced Packaging Process Control

7th December 2021

Theme: Solidifying the collaboration of the semiconductor supply chain in Taiwan for the success of AI chip, 5G, memory, power semiconductor and automotive electronics.

08:15 – 08:45

Registration

Moderator
TSMC – Shin-Puu Jeng, Director

AI Chip / IoT Session

Allen Lu photo
08:50 – 09:10

Keynote Speaker: Mediatek

  • Allen Lu
    Senior Director Computing and Artificial Intelligence Technology Group
  • How 5G and AI are Powering Our Intelligent Future
Jonathan Chang photo
09:15 – 09:35

Keynote Speaker: Xilinx

  • Jonathan Chang
    Senior Director, Foundry Technology Development
  • Enabling 3DIC Integration for Versal and Beyond
James Shih photo
09:40 – 10:00

Intel

  • James Shih
    Senior Director of Platform Application, IoTG
  • Edge Computing with IoT & AI
10:05 – 11:05

Tea & Coffee Break
Networking & Business Meetings 6 & 7

Luba Tang photo
11:10 – 11:30

Skymizer

  • Luba Tang
    Founder & CEO
  • Anchors While Both Hardware and Software are Changing in AI Semiconductor
Edward Wei photo
11:35 – 11:55

Realtek Semiconductor Corp.

  • Edward Wei
    Special Assistant to President
  • Edge AI Processor: The Good/Bad/Ugly and the Need to KISS
Raja Swaminathan photo
12:00 – 12:20

AMD

  • Raja Swaminathan
    Senior Fellow Packaging
  • Advanced Packaging: Enabling Moore’s Law’s Next Frontier
    Through Heterogeneous Integration
12:25 – 13:25

Networking Lunch
Business Meetings 8

Moderator
Intel – CJ Hsieh, General Manager

Memory Session

Dr. Akshay Singh photo
13:30 – 13:50

Micron

  • Dr. Akshay Singh
    VP, Advanced Packaging Technology Development
  • Advanced Memory Packaging for AI and HPC
Dr. Jen-Tai Hsu photo
13:55 – 14:15

GUC

  • Dr. Jen-Tai Hsu
    VP IP Engineering
  • Advanced Packaging Technology (APT) 2.5D and 3D IC IPs: High Bandwidth Memory (HBM) and Die-to-Die (D2D) IPs
Shawn Yu photo
14:20 – 14:40

Powerchip

  • Shawn Yu
    Director, Technical Marketing
  • A New Dimension for Memory and AI
Dr. Keh-Chung Wang photo
14:45 – 15:05

Macronix International Corporation, Ltd.

  • Dr. Keh-Chung Wang
    Chief Scientist
  • Prospects of Flash Memories and Memory-Centric Computing
15:10 – 16:10

Tea & Coffee Break
Networking & Business Meetings 9 & 10

Moderator
Andy Chuang, Senior Consultant

Power Semiconductor & Automotive Electronics Session

Eric Chou
16:15 – 16:35

STMicroelectronics

  • Eric Chou
    Director, Power & Energy Competence Center, Asia Pacific
  • Role of Wide Bandgap Materials in Power & Energy
Stephen Coates photo
16:40 – 17:00

GaN Systems

  • Stephen Coates
    GM & VP Global Operations
  • Past to Present: GaN is Now a True Game Changer
William Wei photo
17:05 – 17:25

MIH Consortium

  • William Wei
    CTO, Foxconn Group
  • Open EV Platform – Building Blocks for The Software Defined EV
Chih-Yi Lin photo
17:30 – 17:50

Delta Electronics Inc.

  • Chih-Yi Lin
    RD Director
  • Technical Need of A High Power Density Power Electronics
    Product
17:55 – 20:00

Closing Dinner