Agenda – TISES 2021
6-7 December 2021 | Taipei, Taiwan
6th December 2021
Theme: Advanced Packaging and Testing
The new industry battleground – smaller, more powerful and more energy efficient chips through advanced packaging and testing
08:15 – 08:45
Registration
08:50 – 09:05
Welcome Speech
Moderator
Andy Chuang, Senior Consultant



10:30 – 11:30
Tea & Coffee Break
Networking & Business Meetings 1 & 2


12:25 – 13:25
Networking Lunch
Business Meetings 3
Moderator
Unimicron – Yu-Hua Chen, VP Carrier SBU/RD Division




15:10 – 16:10
Tea & Coffee Break
Networking & Business Meetings 4 & 5
Moderator
Vanguard – Yens Ho, Director R&D
Gorgeous Technology – Joseph Chou, Director Business Development
Equipment Suppliers






18:05 – 20:10
Gala Dinner

7th December 2021
Theme: Solidifying the collaboration of the semiconductor supply chain in Taiwan for the success of AI chip, 5G, memory, power semiconductor and automotive electronics.
08:15 – 08:45
Registration
Moderator
TSMC – Shin-Puu Jeng, Director
AI Chip / IoT Session



10:05 – 11:05
Tea & Coffee Break
Networking & Business Meetings 6 & 7



12:25 – 13:25
Networking Lunch
Business Meetings 8
Moderator
Intel – CJ Hsieh, General Manager
Memory Session




15:10 – 16:10
Tea & Coffee Break
Networking & Business Meetings 9 & 10
Moderator
Andy Chuang, Senior Consultant
Power Semiconductor & Automotive Electronics Session



