Chris Scanlan photo
2022 Speaker

Chris Scanlan

  • Besi
  • SVP Technology
  • Biography

Chris Scanlan is Senior Vice President Technology at Besi where he is leading advanced technology road map development and technical promotion. Prior to joining Vice President of Worldwide Applications Engineering at JCET Group where he was responsible for business development, technical program management, and product design. From 2009 to 2019 he was SVP of Product Development at Deca Technologies, a wafer level packaging technology provider. As a founding member of Deca, Chris was primarily responsible for the development of Deca’s portfolio of intellectual property and technology relating to M-Series fan-out, Adaptive Patterning and advanced wafer-level manufacturing methods. Chris worked at Amkor Technology for 10 years where he held leadership positions including VP of Global R&D, VP of the Advanced Products business unit and VP of the System-in-Package business unit. Chris started his career at Motorola Semiconductor where we developed a manufacturing line for high power IGBT modules, and managed the transfer of Motorola’s fcCSP technology from R&D to production. He has 70 issued US patents related to semiconductor packaging. He earned his Master of Science degree in Materials Engineering from the University of Wisconsin-Milwaukee.

  • Presentation

Advances in Interconnect and Assembly Technologies for Next Generation Electronic Systems

Advanced interconnect technology is becoming ever more prominent in the development of leading edge electronic systems. Chiplet architectures and advanced SiP devices require integration of multiple chips with advanced, fine pitch interfaces. This presentation will discuss some of the challenges and equipment solutions to enable next generation electronic systems.

Besi logo
  • Company Profile


BE Semiconductor Industries N.V. (“Besi”)is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries focusing primarily on the advanced packaging segment of the market. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud infrastructure, computing, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY Nasdaq International Designation) and its headquarters are located in Duiven, the Netherlands. Research and Development is organizedin Switzerland, Austria and the Netherlands. Support and production is in Singapore, Malaysia and China. For more information, please visit our website at

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