Keynote: Dr. Akshay Singh
- Stanford Graduate School of Business Executive Program graduate, Stanford University
- Ph.D. and M.S, ., Mechanical Engineering, Louisiana State University
- B.E., Mechanical Engineering, Maharaja Sayajirao University
Dr. Akshay Singh is vice president of Advanced Packaging Technology Development at Micron Technology. He joined Micron in May 2006. He leads a global team that is responsible for delivering advanced memory packaging solutions for high performance compute and AI/ML. Prior to joining Micron, Dr. Singh held product development positions at Artificial Muscle, Inc. and USDA. Dr. Singh holds master and doctoral degrees in mechanical engineering from LSU, bachelor degree in mechanical engineering from MS University and is a graduate of the Stanford Graduate School of Business Executive Program.
Advanced Packaging for Memory: Breaking New Frontiers
We need to break through the memory wall to deliver higher performance and lower power. This will require innovation, but what got us here is not enough to get us where we need to be. In this talk, we will discuss how we need to change the innovation paradigm to not only innovate within our own spheres but also co-innovate across our ecosystem.
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.