Elpin Goh photo
2022 Speaker

Elpin Goh

  • Lam Research
  • Senior Director Business Development, Specialty Technologies
  • Biography

Elpin Goh is Senior Director of Specialty Technologies Business Development at Lam Research. She is responsible for business strategy development and planning in Specialty Technologies in APAC region. She works with various Lam product owners to define product strategy and drive innovative product solutions in Specialty Technologies.

Prior to this, Elpin focused on the sales account management in Lam SEA. Elpin’s experience includes process integration, product management, sales and business development in the foundry and semiconductor equipment industry. She started her career as a process integration engineer at GlobalFoundries where she held various positions in process integration, customer engineering, product management and business development.

Elpin received a Master’s degree in Electrical Engineering from National University of Singapore, Singapore. She also holds a Bachelor’s degree from University of Manchester Institute of Science and Technology, UK.

  • Presentation

Enabling Specialty Technologies and Advanced Packaging Solutions to Improve the Functionality and Performance of Electronic Systems

As technology node scaling becomes increasingly complex and expensive, an increasing number of semiconductor manufacturers and foundries are turning to the development of specialty technologies and advanced packing solutions to deliver increased system functionality and performance whilst managing development costs.

Specialty technologies such as sensors (MEMS, CIS and IR sensors), RF devices, optoelectronics, advanced power semiconductors (MOSFETs and IGBTs), and bipolar-CMOS-DMOS (BCD) power management ICs are key to enabling applications in consumer electronics, automotive electronics, IoT applications and cellular communications; including 5G. This trend means that by 2023 these specialty technologies will account for approximately 30% of all global IC demand1.

At the same time, this high cost of scaling single chip solutions is also driving development of heterogeneous chip integration using advanced packaging. These heterogenous integration schemes are focussed on bringing together multiple chips and functions in a single package. While conceptually very similar to multi-chip modules, recent developments deploy a strategy of using advanced wafer manufacturing technologies to meet the ever-increasing performance and form factor requirements.

This presentation will talk about the trends in specialty technologies and heterogenous integration through advanced packaging as well as how the technical challenges associated with these applications can be addressed by high volume CMOS manufacturing solutions.

  1. 1. IC Insights, McClean Forecast, Feb 2022

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  • Company Profile

Lam Research

Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com.

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