
Elpin Goh
Elpin Goh is Senior Director of Specialty Technologies Business Development at Lam Research. She is responsible for business strategy development and planning in Specialty Technologies in APAC region. She works with various Lam product owners to define product strategy and drive innovative product solutions in Specialty Technologies.
Prior to this, Elpin focused on the sales account management in Lam SEA. Elpin’s experience includes process integration, product management, sales and business development in the foundry and semiconductor equipment industry. She started her career as a process integration engineer at GlobalFoundries where she held various positions in process integration, customer engineering, product management and business development.
Elpin received a Master’s degree in Electrical Engineering from National University of Singapore, Singapore. She also holds a Bachelor’s degree from University of Manchester Institute of Science and Technology, UK.
Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications
A wide range of applications in consumer electronics, automotive electronics, IoT applications and 5G cellular communications are increasingly dependent on devices such as sensors, including MEMS, and CMOS image sensors, RF Devices, advanced power semiconductors and Bipolar-CMOS-DMOS ICs. This trend means these specialty technologies currently account for approximately 30% of all global IC demand1.
Deep reactive ion etching (DRIE), initially developed for the fabrication of MEMS devices2, has since become one of the key enabling technologies used in the fabrication of such devices as well as in advanced packaging schemes that require through silicon via (TSV) integration. At the same time, demands on the capability of the DRIE process have increased as device architectures have advanced and production has shifted to high volume manufacturing on 300mm substrates.
Lam Research’s Rapidly Alternating Process (RAP) and Syndion® DRIE tools have been well established in such high-volume manufacturing for more than two decades. Today we are focused on continued enhancement of our systems and process control methodologies in order to meet future requirements.
In this work we show how development of our deep silicon etch hardware and process capabilities is resulting in significant improvements in on-wafer results and supporting next generation device fabrication. Such challenges include the continuous improvement of process productivity, improved profile control, achieving smoother etched sidewalls, and improving uniformity of both etch depth and feature CD.
To illustrate this, we will discuss critical applications such as advanced deep trench isolation (DTI) in CMOS image sensors, etching of power device trenches and TSV fabrication.
- IC Insights, McClean Report, Feb 2022
- Franz Laermer and Andrea Schilp, Robert Bosch GmbH, Method of anisotropically etching silicon, United States Patent 5501893

Lam Research
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com.
More Speakers
Dr. Bill En
AMD
Dr. Ofer Shacham
Meta
Dr. Bor-Sung Liang
MediaTek
Steve Pawlowski
Micron
Dr. Seungwook Yoon
Samsung Electronics
Kam Lee
TSMC
Abul Nuruzzaman
Adeia
Michael Chang
Advantest
Aziza Dada
Airspace
Walter Chen
Amkor
Albert Lan
Applied Materials
Dr. C.P. Hung
ASE
Nelson Fan
ASMPT
CJ Hsieh
Aspeed
Ian Chan
Cyntec
Dr. Justin Chueh
Etron
Ralph Zoberbier
Evatec
Andy Chuang
GaN Systems
Stephen Coates
GaN Systems
Bruce Lu
Goldman Sachs
Dr. Wei-Chung Lo
ITRI
Dr. Ming-Der Shieh
ITRI
Ray Yang
ITRI
Dr. Christian Ohde
MKS | Atotech
Marco Mezger
Neumonda / APIS4
Dr. Kuan-Neng Chen
NYCU
Dr. Monita Pau
Onto Innovation
Vincent Wang
Onto Innovation
Dr. Charles Li
PlayNitride
Patrick Chiang
Qualcomm
Jian Zhang
Qualcomm
Luba Tang
Skymizer Taiwan, Inc.
Thomas Schmidt
SUSS MicroTec
Steven Hsu
UMC