Gary Chen received the Master degree in chemistry from National Cheng Kung University, Taiwan, and Executive Master of Business Administration from National Taiwan University.
From 1997 to 2015, he was a Senior Engineer and the Department Director with the Process & Product Development in Unimicron. From 2015 to 2017, he was Vice President with Product, R&D & CSP plant. Since 2017, he is currently the Senior Vice President of Operation III in Carrier SBU. He had working experience in product design & integration, process engineering, R&D, factory management & new product development for substrate more than 25 years.
Panel Discussion Sponsored by Applied Materials: More-than-Moore Packaging Technology Outlook and Current Supply Chain Constraints
Unimicron is a world leading company of printed circuit board (PCB) manufacturing. Major products include PCBs, high density interconnection (HDI) boards, flexible PCBs, rigid flex PCBs, and integrated circuit (IC) substrates. Product applications include smartphones, PC/NB, server, optical module, automotive and more. Unimicron’s global footprint encompass manufacturing sites and/or service centers in Taiwan, China, Germany, and Japan, to deliver high value-added, high quality and high productivity innovation and service to our global customers.
Unimicron’s high-end substrate solutions, FCBGA and FCCSP, provide our valued customers the technologies crucial in meeting today’s fast-growing development of 5G, HPC and AIoT applications. Our customer-oriented service, high quality standards, and innovative breakthroughs have helped Unimicron achieve the honor of ranking No.1 among the global substrate suppliers by market share for the 5th consecutive year since Y2016. At this brink of technology inflection, Unimicron will continue to collaborate with our customers in delivering world’s best semiconductors.