Jeroen van Borkulo photo
2022 Speaker

Jeroen van Borkulo

  • ASMPT
  • Head of Business & Marketing
  • Biography

Jeroen van Borkulo received a Bachelors’ degree in Applied Physics – specialized in photonics from the Hague University of Applied Sciences and followed Executive Program at Nyenrode Business University.

Joined ASMPT in 2014 in the role of product marketing manager. In his current role leads the business development and marking team for ASMPT’s Laser dicing and grooving BU. Jeroen has over 20 years’ experience in laser material processing applications in the semiconductor industry.

  • Presentation

How Laser is Enabling the Semiconductor Advanced Packaging Roadmap

Wafer singulation in the semiconductor industry has transformed in recent years from having to dice predominantly Si to a complex stack of various materials in which the Si substrate is a relatively small portion of the total stack thickness. As Moore’s law is running out of steam, more focus is put on advanced packaging to keep the momentum going. Heterogeneous Integration, Hybrid bonding and 3D packaging, are some of the technologies which must further accelerated the packaging market in the coming years. For these types of packaging technologies, a traditional blade dicing process is encountering serious yield issues. These issues can be addressed by applying hybrid dicing technologies such as DBG, SDBG or Plasma dicing. However, as the wafers are becoming thinner and have many other materials in the dicing street other than Si, these process flows are not providing the yield, cost, flexibility and productivity required.

For wafer thicknesses in the range of 20µm up to 150µm, the laser ablation singulation process has become the process of record in many applications. For wafer thicknesses beyond the 150µm, other singulation technologies can be used such as plasma dicing or stealth, however a laser ablation process is still required to enable these technologies.

In this presentation we will share the results achieved with ASMPT’s multi beam nano second UV laser ablation as well as the Ultra Short pulse Laser grooving technologies.

ASMPT’s laser technology is an enabler for the technology leaders in the semiconductor industry to release their advanced packaging roadmap.

ASMPT logo - enabling the digital world
  • Company Profile

ASMPT

ASM Pacific Technology Ltd (ASMPT), founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

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