Kam Lee photo
2022 Speaker

Keynote: Kam Lee

  • TSMC
  • Senior Director, Deputy Head of TSMC Advanced Packaging Technology and Service
  • Biography

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier this year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

  • Presentation

Advancement in the 3DFabric Technology and Manufacturing

As semiconductor process scaling continues, it is becoming harder to achieve good yields on advanced silicon technology nodes. As such, heterogeneous integration through advanced packaging is becoming more and more important, not only from the yield & cost perspective, but also performance. The keynote speech will touch on the TSMC’s efforts in the development of 3DFabric advanced packaging technology and the transformation of backend manufacturing to adopt front-end-like automation, in order to deliver the industry-leading advanced packaging solutions.

Tsmc logo
  • Company Profile

TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

 

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