KeunSoo joined Amkor in 2000 and is currently responsible for leading the advanced product development team at Amkor Taiwan. Prior to joining Amkor, he worked as a researcher at the Korea Research Institute of Chemical Technology Center. KS has more more than twenty years of experience in the semiconductor assembly industry, specializing in materials, processes and flip chip development. He holds more than 19 US and Korea patents. KeunSoo earned a masters in polymer engineering from Chungnam National University and an MBA from EBS.
Advanced Packaging Technologies Enable New Applications
Countries around the world have established aggressive goals to reduce overall carbon emissions by 2030. These initiatives, coupled with consumer demand, are driving the electric vehicle (EV) market. To provide the required technologies integrated circuit (IC) suppliers are developing advanced technology roadmaps. At the same time, the semiconductor industry has entered a new era in packaging for microprocessors, field-programmable gate arrays (FPGAs) and artificial intelligence (AI) accelerators. This presentation discusses package technologies that address the needs of these new high-performance packaging applications. It includes options for high performance packaging, including silicon interposers, fan-out on substrate, System-in-Package (SiP) and other alternatives. These advanced packaging technologies can help system designers satisfy the growing demands in several markets.
Amkor Technology, Inc.
Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs.
Amkor’s broad package portfolio offers our customers semiconductor and test solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.
Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US. For more information, visit www.amkor.com.