Dr. Seungwook Yoon photo
2022 Speaker

Keynote: Dr. Seungwook Yoon

  • Samsung Electronics
  • CVP/Head of Team of Package Technology Strategy and Planning
  • Biography

Dr. YOON is currently working as Corporate VP/Head of Team of Package Technology Strategy and Planning, Samsung Electronics.

Prior to joining Samsung, He was director of group technology strategy, STATS ChipPAC, JCET Group. He also worked deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR, Singapore. YOON received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 300 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging. Served as technical committee member of various international packaging technology conferences, EPTC, ESTC, iMAPS, IWLPC and SEMI.

  • Presentation

Advanced Package Technology for Heterogeneous Integration

The advent of smart systems will require 3 time more data and connected devices that of today by 2025. Silicon technology with low power consumption, high capacity, and high density will be developed to satisfy such demands. The limit of silicon technology will be overcome by heterogeneous integration and 3D IC, which can be run under current technology level, will be a great solution for high density products.

Samsung’s Advanced Package FAB solutions provide complementary and extended PKG platforms including Fanout Package, TSV, 2.5D, 3D as well as 3D SiP.

Currently higher computing power and memory bandwidth are the major requirements of AI and GPU, accelerators and network devices. And the on-going increase in performance requirements from Cloud to Edge to on-premise use cases requre tighter coupling of compute, memory and storgae resources. So memory coherency and low latency attributes across converged compute infrastructure with interconnect technologies including UCLe (Universal Chiplet Interconnect Express) and CXL (Compute Express Link).

These demands lead to the adopioin of advanced wafer level packging solutions to increase bandwidth desnity, thermal performance and to improve electrical performance with shorter interconnection with th hybrid Cu bonding (HCB) or fine pitch imcrobump bonding.

In this presentation, the APFS (Advanced Packaging Fab Solutions) are to be introduced and discussed in terms of challenges and opportunites for emerging high-end computing, memory and mobile platforms.

Samsung logo
  • Company Profile

Samsung Electronics

Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.

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